Kiyosu, Japan, November 30, 2021: Toyoda Gosei Co., Ltd. invested in Wonder Future Corporation, a Tokyo-based startup with strengths in electronic component mounting technology, in October 2021. Wonder Future Corporation possesses original induction heating (IH reflow) technology for soldering multiple spots (a very small 0.2 mm) simultaneously. It holds promise for efficient mounting of electronic components on low heat resistance material such as plastics, the main material in many of Toyoda Gosei’s major products.

Through collaboration with the company, Toyoda Gosei will continue to develop products that offer both functionality and design, such as front grilles, cockpits, steering wheels and other plastic parts with sensing, signage and other functions, to meet the needs of evolving CASE and MaaS technologies.

Profile of Wonder Future Corporation

Name	Wonder Future Corporation
Location	C-5 Bldg. 9B, 1-21-5 Kandasudacho, Chiyoda-ku, Tokyo 101-0041, Japan
CEO	Koki Fukuda
Founded	April 2013
Capital	JPY20 million (as of October 31, 2021)

Use of IH reflow technology in interior
and exterior products